Pui-In Mak (Elvis) was born in Macau ('79), and raised there with his early education in Escola de Santa Teresa and Instituto Salesiano. He received the B.Sc. (’03) and Ph.D. (’06) degrees from the University of Macau (UM), where he is currently Full Professor at the Faculty of Science and Technology (FST) - Electrical and Computer Engineering (ECE); Director at the State-Key Laboratory of Analog and Mixed-Signal VLSI, and Deputy Director (Research) at the Institute of Microelectronics. His research focuses are on circuits and systems for wireless and multidisciplinary innovations. He has advised 60+ graduate students and 20+ researchers.
He co-developed 44 state-of-the-art chips reported consecutively at the 2011-2025 IEEE International Solid-State Circuits Conference - ISSCC (Chip Olympics), of which 10 are ISSCC Highlight Papers. His graduates are with universities/companies developing cutting-edge topics/products for a wide variety of applications like 5G+ precision analog, smart energy, IoE connectivity and automotive.
His group pioneered the Intelligent Digital Microfluidic (iDMF) and micro-Nuclear Magnetic Resonance (micro-NMR) platforms for biological/chemical diagnostics. The works led to multidisciplinary publications in leading journals: Nature Communications, Advanced Science, Microsystems & Nanoengineering, Lab on a Chip, ACS Analytical Chemistry, ACS Sensors, Biosensors and Bioelectronics, Sensors and Actuators, etc. In 2018, the group founded the DigFluidic Biotech Ltd. for commercializing the iDMF platform for virus screening and food-quality monitoring.
He has co-authored ~590 publications (12 books/book chapters, 330+ papers in journals and 250+ in conferences) and holds 35+ patents (issued/filed). He has delivered 120+ lectures as keynotes (PRIME'16, RFID-TA'16, ICAC'19, ICTA'19, APCCAS'21, ICICM'22, ICICM'23, Hisi Analog Technology Summit'25), industrial seminars (Qualcomm'17, imec'17) and tutorials/short courses (ISCAS'12, APCCAS'12, VLSI-DAT'15, ACTS'20).
Prof. Mak is recognized globally for his scientific merits and leadership. He received several medals and fellowships from prestigious academies and societies, and is the Editor-in-Chief of IEEE Solid-State Circuits Letters (2024-2026). His research works have been recognized with many awards, including the Tencent Xplorer Prize in 2022 and the ISSCC 70th Anniversary Top Paper Contributors in 2023.
Global Collaboration:Chinese Academy of Sciences, Stanford U., Harvard U., U. of Pavia, imec, UC Dublin, IST-ULisboa, etc
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